Siemens SIPLUS ET 200SP BU Type M0 Backplane
Siemens SIPLUS ET 200SP backplane, rated for -40 to +70Β°C with R1 redundancy.
The Siemens SIPLUS ET 200SP BU Type M0 backplane (6AG1193-6BR00-7HM0) is designed for the ET 200SP distributed I/O system. Based on the 6ES7193-6BR00-0HM0, this backplane operates reliably in harsh environments with a temperature range of -40Β°C to +70Β°C. It is equipped with two slots specifically for holding R1-capable interface modules (IM 155-6 PN R1) and includes a server module.
This backplane is crucial for building robust I/O configurations in demanding industrial settings such as chemical plants, outdoor installations, or areas with extreme temperature variations. Its R1 redundancy capability enhances system availability.
Stanlo Automation, your trusted veteran-owned source for surplus industrial automation parts, offers the Siemens SIPLUS ET 200SP BU Type M0 backplane (6AG1193-6BR00-7HM0). Secure reliable components for your critical applications.
| Series | SIPLUS ET 200SP |
| Type | BU Type M0 |
| Operating Temperature | -40...+70 Β°C |
| Slots | 2 for R1 interface modules |
| Interface Module Support | IM 155-6 PN R1 |
| Includes | Server module |